diff --git a/content/post/building-the-hardrock50.md b/content/post/building-the-hardrock50.md
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@@ -19,6 +19,8 @@ All SMD parts are already pre-soldered so the parts list is quite managable. The
 
 The next steps are winding the toroids / transformators and then populating the main PCB.
 
+![hr50-1b.jpg](/img/hr50-1b.jpg)
+
 Only then I realized that the main PCB will be mounted upside down on the top of the enclosure - which is the heat sink. The MOSFETs are placed on the PCBs bottom side together with a temperature sensor and are therefore mechanically/thermally connected with the heat sink part of the enclosure.
 
 ![hr50-2.jpg](/img/hr50-2.jpg)
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